๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Kinetics of reactive diffusion between Au and Sn during annealing at solid-state temperatures

โœ Scribed by T. Yamada; K. Miura; M. Kajihara; N. Kurokawa; K. Sakamoto

Publisher
Elsevier Science
Year
2005
Tongue
English
Weight
342 KB
Volume
390
Category
Article
ISSN
0921-5093

No coin nor oath required. For personal study only.

๐Ÿ“œ SIMILAR VOLUMES

Growth behavior of Ni3Sn4 layer during r
Growth behavior of Ni3Sn4 layer during reactive diffusion between Ni and Sn at solid-state temperatures
โœ M. Mita; M. Kajihara; N. Kurokawa; K. Sakamoto ๐Ÿ“‚ Article ๐Ÿ“… 2005 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 226 KB

The solid-state reactive diffusion between Ni and Sn was experimentally studied using Sn/Ni/Sn diffusion couples. The diffusion couples were prepared by a diffusion bonding technique and then annealed at temperatures between T = 433 and 473 K for various times in an oil bath with silicone oil. At th