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Effects of Co and Ni addition on reactive diffusion between Sn–3.5Ag solder and Cu during soldering and annealing

✍ Scribed by F. Gao; T. Takemoto; H. Nishikawa

Publisher: Elsevier Science
Year: 2006
Tongue: English
Weight: 782 KB
Volume: 420
Category: Article
ISSN: 0921-5093
DOI: 10.1016/j.msea.2006.01.032

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