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Kinetics of reactive diffusion in the (Au–Ni)/Sn system at solid-state temperatures

✍ Scribed by Y. Yato; M. Kajihara

Publisher
Elsevier Science
Year
2006
Tongue
English
Weight
392 KB
Volume
428
Category
Article
ISSN
0921-5093

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Growth behavior of Ni3Sn4 layer during reactive diffusion between Ni and Sn at solid-state temperatures
✍ M. Mita; M. Kajihara; N. Kurokawa; K. Sakamoto 📂 Article 📅 2005 🏛 Elsevier Science 🌐 English ⚖ 226 KB

The solid-state reactive diffusion between Ni and Sn was experimentally studied using Sn/Ni/Sn diffusion couples. The diffusion couples were prepared by a diffusion bonding technique and then annealed at temperatures between T = 433 and 473 K for various times in an oil bath with silicone oil. At th