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Growth behavior of Fe2Al5 during reactive diffusion between Fe and Al at solid-state temperatures

โœ Scribed by D. Naoi; M. Kajihara


Publisher
Elsevier Science
Year
2007
Tongue
English
Weight
449 KB
Volume
459
Category
Article
ISSN
0921-5093

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Growth behavior of Ni3Sn4 layer during r
โœ M. Mita; M. Kajihara; N. Kurokawa; K. Sakamoto ๐Ÿ“‚ Article ๐Ÿ“… 2005 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 226 KB

The solid-state reactive diffusion between Ni and Sn was experimentally studied using Sn/Ni/Sn diffusion couples. The diffusion couples were prepared by a diffusion bonding technique and then annealed at temperatures between T = 433 and 473 K for various times in an oil bath with silicone oil. At th