Growth behavior of Ni3Sn4 layer during r
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M. Mita; M. Kajihara; N. Kurokawa; K. Sakamoto
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Article
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2005
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Elsevier Science
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English
โ 226 KB
The solid-state reactive diffusion between Ni and Sn was experimentally studied using Sn/Ni/Sn diffusion couples. The diffusion couples were prepared by a diffusion bonding technique and then annealed at temperatures between T = 433 and 473 K for various times in an oil bath with silicone oil. At th