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Growth behavior of compound layers during reactive diffusion between solid Cu and liquid Al

✍ Scribed by Y. Tanaka; M. Kajihara; Y. Watanabe

Publisher: Elsevier Science
Year: 2007
Tongue: English
Weight: 463 KB
Volume: 445-446
Category: Article
ISSN: 0921-5093
DOI: 10.1016/j.msea.2006.09.047

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