Growth behavior of compound layers in Sn/Cu/Sn diffusion couples during annealing at 433–473 K

✍ Scribed by T. Takenaka; S. Kano; M. Kajihara; N. Kurokawa; K. Sakamoto

• Publisher: Elsevier Science
• Year: 2005
• Tongue: English
• Weight: 276 KB
• Volume: 396
• Category: Article
• ISSN: 0921-5093
• DOI: 10.1016/j.msea.2005.01.025