Numerical analysis for migration of interface between liquid and solid phases during reactive diffusion in the binary Cu–Al system

✍ Scribed by Y. Tanaka; M. Kajihara

• Publisher: Elsevier Science
• Year: 2007
• Tongue: English
• Weight: 321 KB
• Volume: 459
• Category: Article
• ISSN: 0921-5093
• DOI: 10.1016/j.msea.2006.12.092