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[Japan Soc. Appl. Phys 2002 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2002) - Kobe, Japan (4-6 Sept. 2002)] International Conferencre on Simulation of Semiconductor Processes and Devices - System level model of damping effects for highly perforated torsional microstructures

โœ Scribed by Schrag, G.; Sattler, R.; Wachutka, G.


Book ID
120988097
Publisher
Japan Soc. Appl. Phys
Year
2002
Tongue
Japanese
Weight
290 KB
Category
Article
ISBN-13
9784891140274

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