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Ion plating of copper layers on titanium: Influence of preparation parameters and deformation on the residual stresses

✍ Scribed by I. Riebeling; K. Thoma; H. Gärtner

Publisher: Elsevier Science
Year: 1985
Weight: 922 KB
Volume: 69
Category: Article
ISSN: 0025-5416
DOI: 10.1016/0025-5416(85)90344-1

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