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Investigation of the corrosion resistance of soldered copper joints

✍ Scribed by E. I. Stopchai; Yu. F. Shein; Yu. N. Lantushenko; G. I. Timashova

Publisher
Springer
Year
1972
Tongue
English
Weight
144 KB
Volume
8
Category
Article
ISSN
0009-2355

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A BGA package warping produced hybrid deformations in the solder joint interconnections. This situation creates difficult challenges in avoiding certain mechanical failure problems and even maintaining acceptable electrical performance in the electronic package. Accessing electronic circuit simulati