A BGA package warping produced hybrid deformations in the solder joint interconnections. This situation creates difficult challenges in avoiding certain mechanical failure problems and even maintaining acceptable electrical performance in the electronic package. Accessing electronic circuit simulati
โฆ LIBER โฆ
Variation in the electrical resistance of soldered joints
โ Scribed by A. G. Shelepaev
- Publisher
- Springer US
- Year
- 1975
- Tongue
- English
- Weight
- 106 KB
- Volume
- 18
- Category
- Article
- ISSN
- 0543-1972
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