A BGA package warping produced hybrid deformations in the solder joint interconnections. This situation creates difficult challenges in avoiding certain mechanical failure problems and even maintaining acceptable electrical performance in the electronic package. Accessing electronic circuit simulations for packages design is the major objective of this research. In this paper, an analytical model of equivalent solder joint interconnection resistors was developed to predict the variety in the electrical resistance with various combinations of vertical and shear strains at different environmental temperatures. Compression and shear experiments were employed to confirm the analytical model. This model was then applied to predict the variations in solder joint resistance at ambient and 120 8C temperatures with hybrid deformations. The resistance linearly increased and decreased as the solder joint experienced tension and compression. Once the shearing strain conjugated, the variational tendency akin to an exponential function was performed to demonstrate that the shearing strain dominated the change in resistance. This tendency was aggravated at higher environmental temperatures.