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Influence of heat treatments on the electrical resistance of thin film copper/electroless nickel microcircuit interconnections

✍ Scribed by J.S. Loos; B.A. Ter Haar

Publisher: Elsevier Science
Year: 1990
Tongue: English
Weight: 605 KB
Volume: 188
Category: Article
ISSN: 0040-6090
DOI: 10.1016/0040-6090(90)90287-n

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