Tensile fracture of tin–lead solder joints in copper
✍ Scribed by K.H. Prakash; T. Sritharan
- Publisher
- Elsevier Science
- Year
- 2004
- Tongue
- English
- Weight
- 837 KB
- Volume
- 379
- Category
- Article
- ISSN
- 0921-5093
No coin nor oath required. For personal study only.
📜 SIMILAR VOLUMES
This study forms composite solders by adding 0.5-3 wt% of Ni particles in situ to Sn-3.5 wt%Ag lead-free solder. Cu/solder/Cu specimens are prepared by dipping two Cu rods into a solder bath to produce a solder joint. Some of the joint specimens are retained in the as-soldered condition, while the o
These results indicated that the type of fluonne analyzed affected the efficiency of decomposition. Most fluoro compounds are easier to decompose than these and presumably in these cases the per cent recovery would be improved.
## Abstract A procedure is described for the determination of tin, lead, bismuth, copper, iron, silver, cadmium and zinc in Sn‐Pb alloy, composed of ca. 50% Sn, 47% Pb, and 3% Bi, by means of atomic absorption spectrophotometry. The sample is dissolved in aqua regia. Tin and lead are determined aga