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Investigation of amorphous Ni–Al–N film as diffusion barrier between Cu and SiO2

✍ Scribed by B.T. Liu; J.H. Chen; X.H. Li; K.M. Wang; M. Li; D.Y. Zhao; L. Yang; Q.X. Zhao; L.X. Ma; X.Y. Zhang

No coin nor oath required. For personal study only.

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