✦ LIBER ✦
Corrigendum to “Ta–Rh binary alloys as a potential diffusion barrier between Cu and Si: Stability and failure mechanism of the Ta–Rh amorphous structures” [Acta Mater. 61 (2013) 5365–5374]
✍ Scribed by Dalili, Neda; Liu, Qi; Ivey, Douglas G.
- Book ID
- 122035294
- Publisher
- Elsevier Science
- Year
- 2014
- Tongue
- English
- Weight
- 143 KB
- Volume
- 62
- Category
- Article
- ISSN
- 1359-6454
No coin nor oath required. For personal study only.