Preparation of Ta2Al intermetallic compound films and their application as diffusion barriers to Cu penetration

✍ Scribed by Akira Ohta; Atsushi Noya; Mayumi Takeyama; Masahiro Taguchi; Touko Sase; Katsutaka Sasaki

• Publisher: Elsevier Science
• Year: 1996
• Tongue: English
• Weight: 702 KB
• Volume: 278
• Category: Article
• ISSN: 0040-6090
• DOI: 10.1016/0040-6090(95)08119-4