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Preparation of CuTi-Cu3Ti compound alloy films and their applications as diffusion barrier in Cu/CuTi-Cu3Ti/TiN/Si multilayered contact system

✍ Scribed by Ken-Ichi Yoshimoto; Katsutaka Sasaki; Hideto Yanagisawa; Atsushi Noya


Publisher
John Wiley and Sons
Year
1996
Tongue
English
Weight
629 KB
Volume
79
Category
Article
ISSN
8756-663X

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