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Influence of TiO2nanoparticles on thermal property, wettability and interfacial reaction in Sn–3.0Ag–0.5Cu–xTiO2composite solder

✍ Scribed by Y. Tang, Y. C. Pan, G. Y. Li


Book ID
120681401
Publisher
Springer US
Year
2012
Tongue
English
Weight
708 KB
Volume
24
Category
Article
ISSN
0957-4522

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