Laser drilling of thick material using f
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B. Tan; K. Venkatkrishnan; N.R. Sivakumar; G.K. Gan
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Article
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2003
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Elsevier Science
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English
β 173 KB
Laser drilling is one of the basic, most frequently performed, material removal processes. The drilling aspect ratio is theoretically limited by the size and the focal depth of the machining laser spot. The aspect ratio can be improved by using dual focus. In this paper we describe a focus of two di