Laser drilling of thick material using femtosecond pulse with a focus of dual-frequency beam
✍ Scribed by B. Tan; K. Venkatkrishnan; N.R. Sivakumar; G.K. Gan
- Publisher
- Elsevier Science
- Year
- 2003
- Tongue
- English
- Weight
- 173 KB
- Volume
- 35
- Category
- Article
- ISSN
- 0030-3992
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✦ Synopsis
Laser drilling is one of the basic, most frequently performed, material removal processes. The drilling aspect ratio is theoretically limited by the size and the focal depth of the machining laser spot. The aspect ratio can be improved by using dual focus. In this paper we describe a focus of two di erent frequencies based on the longitudinal chromatic aberration arisen when polychromatic collimated light is incident on a positive lens element. In the experiments, a Ti:Sapphire laser of 800 nm wavelength and 150 fs pulse duration was used as a source. Two tightly focused laser spots few hundred micrometers apart from each other were formed by focusing a combined collimated laser beam which contains the fundamental optic frequency and the second harmonic optic frequency. The focus of dual-frequency beam was used to drill a 3 mm thick PMMA plate. The drilling aspect ratio of a dual-frequency beam was compared to that of a focus of single frequency beam. Experimental results reveal that dual-frequency beam increases the aspect ratio and improves the drilling quality in terms of proÿle of the produced features.