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Indirect laser etching of fused silica: Towards high etching rate processing

✍ Scribed by R. Böhme; K. Zimmer


Publisher
Elsevier Science
Year
2007
Tongue
English
Weight
905 KB
Volume
253
Category
Article
ISSN
0169-4332

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## Abstract A simple and cost‐effective method to manufacture a phase mask with high diffraction efficiency for deep UV application is proposed. The deep rectangular grating fabricated by using laser interference is etched directly into a fused silica substrate, instead of the dielectric coating on