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In-situ measurements of surface mount IC package deformations during reflow soldering

✍ Scribed by Pecht, M.G.; Govind, A.

Book ID: 114560621
Publisher: IEEE
Year: 1997
Weight: 270 KB
Volume: 20
Category: Article
ISSN: 1083-4400
DOI: 10.1109/3476.649442

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