Mechanism of package cracking in plastic encapsulated surface mount package during reflow soldering and corrective action : Kunihiko Nishi, Ichiro Anjoh, Masatugu Ogata, Makoto Kitano and Tohru Yoshida. Proc. 18th Symp. Reliab. Maintainab. (Condensed Version), 29 (June 1988)

• Book ID: 103284332
• Publisher: Elsevier Science
• Year: 1989
• Tongue: English
• Weight: 92 KB
• Volume: 29
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(89)90041-3