Study of soldering heat test method for plastic encapsulated surface mount packages : Masaki Tanaka, Masanori Sakimoto, Hideaki Konishi, Kunihiko Nishi, Kenichi Ohtsuka and Tohru Yoshida. Proc. 18th Symp. Reliab. Maintainab. (Condensed Version), 27 (1988)

• Book ID: 103284344
• Publisher: Elsevier Science
• Year: 1989
• Tongue: English
• Weight: 123 KB
• Volume: 29
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(89)90054-1