✦ LIBER ✦
Moisture induced package cracking in plastic encapsulated surface mount components during solder reflow process : R. Lin, E. Blackshear and P. Serisky. Proc. IEEE/IRPS, 83 (1988)
- Book ID
- 103285685
- Publisher
- Elsevier Science
- Year
- 1989
- Tongue
- English
- Weight
- 266 KB
- Volume
- 29
- Category
- Article
- ISSN
- 0026-2714
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