In-plane strains measurement by using the electronic speckle pattern interferometry
β Scribed by Kim, Koung-Suk ;Jung, Hyun-Chul ;Kang, Ki-Soo ;Lee, Jong-Kook ;Jang, Soon-Suck ;Hong, Chung-Ki
- Publisher
- Springer-Verlag
- Year
- 1998
- Tongue
- Korean
- Weight
- 811 KB
- Volume
- 12
- Category
- Article
- ISSN
- 1226-4865
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We have monitored the evolution of the strain-rates induced on an aluminium sample subjected to a uniaxial tensile test. At different load stages of the test, the strain-rate at each point of the field was obtained from fringe patterns generated by electronic speckle-pattern interferometry (ESPI), a
The surface profile of an Al thin film and its thickness have been observed by electronic speckle pattern interferometry (ESPI). The Michelson interferometer was used as our basic interferometric system to obtain interference fringes on a CCD camera. These interference fringes, arising from the path
In-plane Electronic Speckle Pattern Interferometry has been successfully used during tensile testing of semi-hard copper sheets in order to measure the strain rate. On one hand, heterogeneity in strain rate field has been found before the maximum of the tensile force (Ξ΅ t 19.4 and 25.4%, respectivel