The design, performance and principles of computerised control of an optical micro-electromechanical device combining microtensile device and electronic speckle pattern interferometry (ESPI) to test both elastic and plastic properties of thin metallic, dielectric as well as multilayered freestanding
Measurement of thin film thickness by electronic speckle pattern interferometry
✍ Scribed by Canan Karaaliog̃lu; Yani Skarlatos
- Publisher
- Elsevier Science
- Year
- 2004
- Tongue
- English
- Weight
- 362 KB
- Volume
- 234
- Category
- Article
- ISSN
- 0030-4018
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✦ Synopsis
The surface profile of an Al thin film and its thickness have been observed by electronic speckle pattern interferometry (ESPI). The Michelson interferometer was used as our basic interferometric system to obtain interference fringes on a CCD camera. These interference fringes, arising from the path differences due to the surface contours of the thin film, were analyzed with three different techniques: fast Fourier transform (FFT), phase shifting, and digital image subtraction; and the results were compared with each other. We also derived a new formula for the image subtraction method, which is only valid in one-dimensional calculations. An unwrapping procedure was used to obtain a continuous phase in the FFT and phase shifting methods. Results on thickness measurements are presented and are found to be in good agreement with each other.
📜 SIMILAR VOLUMES
We have monitored the evolution of the strain-rates induced on an aluminium sample subjected to a uniaxial tensile test. At different load stages of the test, the strain-rate at each point of the field was obtained from fringe patterns generated by electronic speckle-pattern interferometry (ESPI), a