Impact of line-edge roughness on resistance and capacitance of scaled interconnects
โ Scribed by M. Stucchi; M. Bamal; K. Maex
- Publisher
- Elsevier Science
- Year
- 2007
- Tongue
- English
- Weight
- 1003 KB
- Volume
- 84
- Category
- Article
- ISSN
- 0167-9317
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โฆ Synopsis
The impact of line-edge roughness (LER) on resistance R and capacitance C of on-chip interconnects is for the first time evaluated by a simulation methodology based on a realistic modeling of LER. The model can be calibrated with measured LER parameters. A geometrical approximations of LER is generated and superimposed to an interconnect architecture model with no roughness; resistance and capacitance are extracted from the model by a 3D static solver to estimate the impact of LER on them. By applying this methodology to the interconnect scaling scenario of the 2005 ITRS Roadmap, a small but increasing detrimental effect of LER on both R and C is predicted.
๐ SIMILAR VOLUMES
## Abstract The work focuses on the impact of the finite and variable MOSFET output resistance on the transient response LC transmission line drivers. Experimental results highlight the severe error occurring in conventional timing analysis when actual finite resistance of the device is neglected.