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[IMAPS - Int. Microelectron. & Packaging Soc International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (6-8 March 2000)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) - Break through developments in electroless nickel/gold plating on copper based semiconductors

✍ Scribed by Strandjord, A.J.G.; Popelar, S.F.; Erickson, C.A.

Book ID: 126768351
Publisher: IMAPS - Int. Microelectron. & Packaging Soc
Year: 2000
Weight: 577 KB
Category: Article
ISBN-13: 9780930815592
DOI: 10.1109/ISAPM.2000.869252

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