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[IMAPS - Int. Microelectron. & Packaging Soc International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (6-8 March 2000)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) - Qualification of the system electroless nickel bumps and PbSn5 for high temperature applications

✍ Scribed by Anhock, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.

Book ID: 126713852
Publisher: IMAPS - Int. Microelectron. & Packaging Soc
Year: 2000
Weight: 406 KB
Category: Article
ISBN-13: 9780930815592
DOI: 10.1109/ISAPM.2000.869251

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