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[IMAPS - Int. Microelectron. & Packaging Soc International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (6-8 March 2000)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) - Self-consistent model for dielectric constant prediction of polymer-ceramic composite

โœ Scribed by Rao, Y.; Wong, C.P.; Jianmin Qu,

Book ID
118044080
Publisher
IMAPS - Int. Microelectron. & Packaging Soc
Year
2000
Weight
422 KB
Volume
0
Category
Article
ISBN-13
9780930815592

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