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[IMAPS - Int. Microelectron. & Packaging Soc International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces - Braselton, GA, USA (14-17 March 1999)] Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) - Direct-write fabrication of integrated, multilayer passive components

✍ Scribed by Dimos, D.; King, B.H.; Yang, P.

Book ID: 115501499
Publisher: IMAPS - Int. Microelectron. & Packaging Soc
Year: 1999
Weight: 582 KB
Volume: 0
Category: Article
ISBN-13: 9780930815561
DOI: 10.1109/isapm.1999.757309

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