𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IMAPS - Int. Microelectron. & Packaging Soc International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (6-8 March 2000)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) - Materials and process technology: materials [flip chip assembly]

✍ Scribed by Estes, R.H.

Book ID: 126870960
Publisher: IMAPS - Int. Microelectron. & Packaging Soc
Year: 2000
Weight: 486 KB
Category: Article
ISBN-13: 9780930815592
DOI: 10.1109/isapm.2000.869234

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IMAPS - Int. Microelectron. & Packaging

[IMAPS - Int. Microelectron. & Packaging Soc International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (6-8 March 2000)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) - Comparison of various micro via technology

✍ Nishiwaki, T.; Mikado, Y.; Kuroiwa, N. 📂 Article 📅 2000 🏛 IMAPS - Int. Microelectron. & Packaging Soc ⚖ 282 KB

[IMAPS - Int. Microelectron. & Packaging

[IMAPS - Int. Microelectron. & Packaging Soc International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (6-8 March 2000)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) - Thru-silicon vias for 3D WLP

✍ Savastionk, S.; Siniaguine, O.; Korczynski, E. 📂 Article 📅 2000 🏛 IMAPS - Int. Microelectron. & Packaging Soc ⚖ 183 KB

[IMAPS - Int. Microelectron. & Packaging

[IMAPS - Int. Microelectron. & Packaging Soc International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (6-8 March 2000)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) - Advancing materials using interfacial process and reliability simulations on the molecular level

✍ Iwamoto, N.E. 📂 Article 📅 2000 🏛 IMAPS - Int. Microelectron. & Packaging Soc ⚖ 375 KB

[IMAPS - Int. Microelectron. & Packaging

[IMAPS - Int. Microelectron. & Packaging Soc International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (6-8 March 2000)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) - Self-consistent model for dielectric constant prediction of polymer-ceramic composite

✍ Rao, Y.; Wong, C.P.; Jianmin Qu, 📂 Article 📅 2000 🏛 IMAPS - Int. Microelectron. & Packaging Soc ⚖ 422 KB

[IMAPS - Int. Microelectron. & Packaging

[IMAPS - Int. Microelectron. & Packaging Soc International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (6-8 March 2000)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) - Break through developments in electroless nickel/gold plating on copper based semiconductors

✍ Strandjord, A.J.G.; Popelar, S.F.; Erickson, C.A. 📂 Article 📅 2000 🏛 IMAPS - Int. Microelectron. & Packaging Soc ⚖ 577 KB

[IMAPS - Int. Microelectron. & Packaging

[IMAPS - Int. Microelectron. & Packaging Soc International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces - Braselton, GA, USA (14-17 March 1999)] Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) - Challenges in the packaging of MEMS

✍ O'Neal, C.B.; Malshe, A.P.; Singh, S.B.; Brown, W.D.; Eaton, W.P. 📂 Article 📅 1999 🏛 IMAPS - Int. Microelectron. & Packaging Soc ⚖ 666 KB