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[IMAPS - Int. Microelectron. & Packaging Soc International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces - Braselton, GA, USA (14-17 March 1999)] Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) - Conductivity mechanisms of isotropic conductive adhesives (ICAs)

✍ Scribed by Daoqiang Lu, ; Tong, Q.K.; Wong, C.P.

Book ID: 126635467
Publisher: IMAPS - Int. Microelectron. & Packaging Soc
Year: 1999
Weight: 673 KB
Category: Article
ISBN-13: 9780930815561
DOI: 10.1109/ISAPM.1999.757278

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