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[IMAPS - Int. Microelectron. & Packaging Soc International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces - Braselton, GA, USA (14-17 March 1999)] Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) - Smart tooling for assembly of thin flexible systems

✍ Scribed by Ruijun Chen, ; Baldwin, D.F.

Book ID: 125475050
Publisher: IMAPS - Int. Microelectron. & Packaging Soc
Year: 1999
Weight: 564 KB
Category: Article
ISBN-13: 9780930815561
DOI: 10.1109/isapm.1999.757325

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