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[IEEE Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium - San Jose, CA, USA (2007.03.18-2007.03.22)] Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium - Stress Minimization During Deflection of Thermally Conductive Gap Pads

✍ Scribed by Bruzda, Karen

Book ID: 126731501
Publisher: IEEE
Year: 2007
Weight: 790 KB
Category: Article
ISBN-13: 9781424409587
DOI: 10.1109/STHERM.2007.352413

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