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[IEEE Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium - San Jose, CA, USA (2007.03.18-2007.03.22)] Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium - DELPHI Style Compact Modeling of Stacked Die Packages

✍ Scribed by Poppe, Andras; Farkas, Gabor; Parry, John; Szabo, Peter; Rencz, Marta; Szekely, Vladimir

Book ID: 126724840
Publisher: IEEE
Year: 2007
Weight: 672 KB
Category: Article
ISBN-13: 9781424409587
DOI: 10.1109/STHERM.2007.352431

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