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[IEEE Twenty Seventh Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium - San Jose, CA, USA (17-18 July 2002)] 27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - Elimination of polyimide stress buffer on integrated circuits using advanced packaging materials

✍ Scribed by Patten, D.; Phou, J.

Book ID: 126720912
Publisher: IEEE
Year: 2002
Weight: 365 KB
Category: Article
ISBN-13: 9780780373013
DOI: 10.1109/IEMT.2002.1032753

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