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[IEEE Twenty Seventh Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium - San Jose, CA, USA (17-18 July 2002)] 27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - Design and characterization of a high-performance wire-bond ball-grid-array package

✍ Scribed by Ching-Chao Huang, ; Secker, D.; Ling Yang, ; June Feng, ; Nirmal Jain,

Book ID: 126697732
Publisher: IEEE
Year: 2002
Weight: 344 KB
Category: Article
ISBN-13: 9780780373013
DOI: 10.1109/IEMT.2002.1032762

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