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[IEEE Twenty Seventh Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium - San Jose, CA, USA (17-18 July 2002)] 27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - Chip scale packaging techniques for RF SAW devices

✍ Scribed by Goetz, M.; Jones, C.

Book ID: 120023549
Publisher: IEEE
Year: 2002
Tongue: English
Weight: 446 KB
Category: Article
ISBN-13: 9780780373013
DOI: 10.1109/IEMT.2002.1032724

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