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[IEEE Twenty Seventh Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium - San Jose, CA, USA (17-18 July 2002)] 27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - Finite element analysis of novel substrate design for high performance and cost reduction stacked die CSP

✍ Scribed by Yueh, W.R.; Lee, J.C.C.; Wu, A.B.L.; Chen, J.C.M.

Book ID: 126594074
Publisher: IEEE
Year: 2002
Weight: 693 KB
Category: Article
ISBN-13: 9780780373013
DOI: 10.1109/IEMT.2002.1032766

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