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[IEEE Systems (DDECS) - Cottbus, Germany (2011.04.13-2011.04.15)] 14th IEEE International Symposium on Design and Diagnostics of Electronic Circuits and Systems - Optimal number and placement of Through Silicon Vias in 3D Network-on-Chip

✍ Scribed by Xu, Thomas Canhao; Liljeberg, Pasi; Tenhunen, Hannu

Book ID: 115525577
Publisher: IEEE
Year: 2011
Weight: 732 KB
Volume: 0
Category: Article
ISBN: 1424497558
DOI: 10.1109/ddecs.2011.5783057

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