𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - A new methodology for modeling MEMS structures

✍ Scribed by Kaiping Zeng, ; Zhenyu Liu, ; Korvink, J.G.

Book ID: 126748098
Publisher: IEEE
Year: 2003
Weight: 378 KB
Category: Article
ISBN-13: 9780780370661
DOI: 10.1109/DTIP.2003.1287030

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE Symposium on Design, Test, Integra

[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Three-dimensional MEMS simulation using euler parameters

✍ Casinovi, G. 📂 Article 📅 2003 🏛 IEEE ⚖ 230 KB

[IEEE Symposium on Design, Test, Integra

[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - "PLUG-UP" - a new concept for fabricating SOI MEMS devices

✍ Kiihamaki, J.; Pekko, P.; Kattelus, H.; Sillanpaa, T.; Mattila, T. 📂 Article 📅 2003 🏛 IEEE ⚖ 358 KB

[IEEE Symposium on Design, Test, Integra

[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - The hierarchical HDL-based design of an integrated MEMS-CMOS oscillator

✍ Gaddi, R. 📂 Article 📅 2003 🏛 IEEE ⚖ 290 KB

[IEEE Symposium on Design, Test, Integra

[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - SU-8 process for biomedical inspection μ-carriers

✍ Chen, P.-H.; Ding, P.-P.; Kuo, J.-S. 📂 Article 📅 2003 🏛 IEEE ⚖ 262 KB

[IEEE Symposium on Design, Test, Integra

[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Capacitive humidity sensor using a polyimide sensing film

✍ Laconte, J.; Wilmart, V.; Raskin, J.-P.; Flandre, D. 📂 Article 📅 2003 🏛 IEEE ⚖ 341 KB

[IEEE Symposium on Design, Test, Integra

[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Behavioral modeling and simulation of micromechanical resonator for communications applications

✍ Mandelbaum, C.; Cases, S.; Bensaude, D.; Basteres, L.; Nachtergaele, P. 📂 Article 📅 2003 🏛 IEEE ⚖ 458 KB