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[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Stress characterization of electroplated gold layers for low temperature surface micromachining

✍ Scribed by Margesin, B.; Bagolini, A.; Guarnieri, V.; Giacomozzi, F.; Faes, A.; Pal, R.; Decarli, M.

Book ID: 121321660
Publisher: IEEE
Year: 2003
Weight: 262 KB
Category: Article
ISBN-13: 9780780370661
DOI: 10.1109/DTIP.2003.1287077

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