𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - The impact of MEMS and NEMS on Biotechnology in the 21st Century

✍ Scribed by Amdou, M.

Book ID: 120546455
Publisher: IEEE
Year: 2003
Weight: 38 KB
Category: Article
ISBN-13: 9780780370661
DOI: 10.1109/DTIP.2003.1286996

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE Symposium on Design, Test, Integra

[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - The hierarchical HDL-based design of an integrated MEMS-CMOS oscillator

✍ Gaddi, R. 📂 Article 📅 2003 🏛 IEEE ⚖ 290 KB

[IEEE Symposium on Design, Test, Integra

[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - SU-8 process for biomedical inspection μ-carriers

✍ Chen, P.-H.; Ding, P.-P.; Kuo, J.-S. 📂 Article 📅 2003 🏛 IEEE ⚖ 262 KB

[IEEE Symposium on Design, Test, Integra

[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Getters films at wafer level for wafer to wafer bonded MEMs

✍ Moraja, M.; Amiotti, M. 📂 Article 📅 2003 🏛 IEEE ⚖ 441 KB

[IEEE Symposium on Design, Test, Integra

[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - A CMOS low noise amplifier for biomedical telemetry applications

✍ Moreno, R.L.; Rodrigues, E.C. 📂 Article 📅 2003 🏛 IEEE ⚖ 281 KB

[IEEE Symposium on Design, Test, Integra

[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Behavioral modeling and simulation of micromechanical resonator for communications applications

✍ Mandelbaum, C.; Cases, S.; Bensaude, D.; Basteres, L.; Nachtergaele, P. 📂 Article 📅 2003 🏛 IEEE ⚖ 458 KB

[IEEE Symposium on Design, Test, Integra

[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Stress characterization of electroplated gold layers for low temperature surface micromachining

✍ Margesin, B.; Bagolini, A.; Guarnieri, V.; Giacomozzi, F.; Faes, A.; Pal, R.; De 📂 Article 📅 2003 🏛 IEEE ⚖ 262 KB