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[IEEE Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings 2000 - San Jose, CA, USA (21-23 March 2000)] Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068) - Thermal behavior of solder bonded and adhesive bonded folded fin assemblies

✍ Scribed by Loh, C.K.; Chou, B.-B.; Nelson, D.; Chou, D.J.

Book ID: 126701981
Publisher: IEEE
Year: 2000
Weight: 592 KB
Edition: 2000, 16th Annual ed.
Category: Article
ISBN-13: 9780780359161
DOI: 10.1109/STHERM.2000.837059

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