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[IEEE SISPAD '97. 1997 International Conference on Simulation of Semiconductor Processes and Devices. Technical Digest - Cambridge, MA, USA (8-10 Sept. 1997)] SISPAD '97. 1997 International Conference on Simulation of Semiconductor Processes and Devices. Technical Digest - CMP profile simulation using an elastic model based on nonlinear contact analysis

โœ Scribed by Yoo-Hyon Kim, ; Tai-Kyung Kim, ; Hoong-Joo Lee, ; Jeong-Taek Kong, ; Sang-Hoon Lee,


Book ID
126718697
Publisher
IEEE
Year
1997
Weight
368 KB
Category
Article
ISBN-13
9780780337756

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