𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - On the mechanical properties of Cu3Sn intermetallic compound through molecular dynamics simulation and nanoindentation testing

✍ Scribed by Wen-Hwa Chen, ; Hsien-Chie Cheng, ; Ching-Feng Yu,

Book ID: 120552421
Publisher: IEEE
Year: 2010
Weight: 906 KB
Category: Article
ISBN: 1424470269
DOI: 10.1109/ESIME.2010.5464610

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