𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Linz, Austria (2011.04.18-2011.04.20)] 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Challenges of power electronic packaging and modeling

✍ Scribed by Liu, Yong; Kinzer, Dan

Book ID: 120820567
Publisher: IEEE
Year: 2011
Weight: 776 KB
Category: Article
ISBN: 1457701073
DOI: 10.1109/ESIME.2011.5765799

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📜 SIMILAR VOLUMES

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